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High Precision BGA Solder Joint Xray Quality Control System AX8300 Unicomp Equipment

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High Precision BGA Solder Joint Xray Quality Control System AX8300 Unicomp Equipment

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Model Number : AX8300

Price : can negotiate

Power Supply : 220V,50Hz/60Hz 4A

Weight : 1350kg

MOQ : 1Set

Delivery Time : 15 days

Warranty : 1 year

Payment Terms : T/T,L/C

Dimension : 1215*1325*1700(mm)

Voltage : 110kv

Supply Ability : 30 sets per month

Product name : AX8300

Brand Name : UNICOMP

Certification : CE, FDA

Place of Origin : China

Packaging Details : Wooden Case, Waterproof, Anti-collision

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High Precision BGA Solder Joint X-ray Quality Control System AX8300
The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV equipment and excessive energy waste of 130kV models.
Integrated with a high-end flat-panel detector (FPD), the AX8300 captures ultra-high-definition, high-magnification images with industry-leading fineness. Supported by a full 360° rotating worktable, the system enables flexible multi-angle observation and comprehensive detection of hidden defects.
Key Features
  • 110kV Microfocus X-ray source
  • High resolution Flat Panel Detector (FPD)
  • X/Y/Z/Tilt Motions (table, tube, FPD)
  • 360° Table Rotation
  • Angle View up to 70 Degrees
  • Point and Click Location Navigation
  • CNC Programming for Multiple Image Inspection Routines
  • Maximum Inspection Area: 360 x 340mm
Applications
BGA/CSP/FLIPS CHIP: Bridging, Voids, Opens, Excessive/Insufficient solder
QFN: Bridging, Voids, Opens, Registration
SMT Standard Components: QFP, SOT, SOIC, Chips, Connectors, Others
Semiconductor: Bond wire, Die attach VOID, MOLD, VOID
Multi-layer Board (MLB): Inner layer registration, PAD stack, Blind/buried vias
Technical Specifications
ModelAX8300
Max kV/Type110 kV/Sealed
Power Consumption900W
Max. Electron Beam Power25W
Focal Spot Size5μm
Geometric Magnification48.8X
Imaging System (Option)Flat Panel Detector
Door OpenHand-operated door
Monitor27" HD 4K Display
Dimensions1215x1325x1700mm
Weight1350kg
Radiation Safety<1μSv/hr
ControlKeyboard/Mouse/Joystick
Automated InspectionStandard
Primary ApplicationsChip inspection/Electronic components/Auto parts, etc.
Note: Focal spot size is variable. Please consult Unicomp for specific requirements.
X-ray Safety Commitment
All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems. The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed 0.5 millirem/hr at 2" from any external surface. Our machines typically emit 15 times less radiation.
Dimensions and Appearance
High Precision BGA Solder Joint Xray Quality Control System AX8300 Unicomp Equipment
Inspection Images
High Precision BGA Solder Joint Xray Quality Control System AX8300 Unicomp Equipment

Product Tags:

BGA solder joint Xray system

      

High precision Xray quality control

      

Unicomp Xray machine equipment

      
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High Precision BGA Solder Joint Xray Quality Control System AX8300 Unicomp Equipment Images

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