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IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning

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IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning

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Model Number : AX8300

MOQ : 1Set

Delivery Time : 15 days

Warranty : 1 year

Payment Terms : T/T,L/C

Dimension : 1215*1325*1700(mm)

Voltage : 110kv

Price : can negotiate

Power Supply : 220V,50Hz/60Hz 4A

Weight : 1350kg

Supply Ability : 30 sets per month

Product name : AX8300

Brand Name : UNICOMP

Certification : CE, FDA

Place of Origin : China

Packaging Details : Wooden Case, Waterproof, Anti-collision

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IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning
The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV equipment and excessive energy waste of 130kV models.
Integrated with a high-end flat-panel detector (FPD), the AX8300 captures ultra-high-definition, high-magnification images with industry-leading fineness. Supported by a full 360° rotating worktable, the system enables flexible multi-angle observation and comprehensive detection of hidden defects.
Key Features
  • 110kV Microfocus X-ray source
  • High resolution Flat Panel Detector (FPD)
  • X/Y/Z/Tilt Motions (table, tube, FPD)
  • 360° Table Rotation
  • Angle View up to 70 Degrees
  • Point and Click Location Navigation
  • CNC Programming for Multiple Image Inspection Routines
  • Maximum Inspection Area: 360 x 340mm
Applications
BGA/CSP/FLIPS CHIP
  • Bridging, Voids, Opens, Excessive/Insufficient solder
QFN
  • Bridging, Voids, Opens, Registration
SMT Standard Components
  • QFP, SOT, SOIC, Chips, Connectors, Others
Semiconductor
  • Bond wire, Die attach VOID, MOLD, VOID
Multi-layer Board (MLB)
  • Inner layer registration, PAD stack, Blind/buried vias
Technical Specifications
Model AX8300
Max kV/Type 110 kV/Sealed
Power Consumption 900W
Max. Electron Beam Power 25W
Focal Spot Size 5μm
Geometric Magnification 48.8X
Imaging System (Option) Flat Panel Detector
Door Open Hand-operated door
Monitor 27" HD 4K Display
Dimensions 1215x1325x1700mm
Weight 1350kg
Radiation Safety <1μSv/hr
Control Keyboard/Mouse/Joystick
Automated Inspection Standard
Primary Applications Chip inspection/Electronic components/Auto parts, etc.
Note: Focal spot size is variable. Please consult Unicomp for specific requirements.
X-ray Safety Commitment
All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems. The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed 0.5 millirem/hr at 2" from any external surface. Our machines typically emit 15 times less radiation.
Dimensions and Appearance
IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning
Inspection Images
IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning

Product Tags:

BGA X-ray inspection machine

      

CSP packaging defect scanner

      

CNC automatic X-ray machine

      
 IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning Manufactures

IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning Images

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